Delivering high integration, low-power consumption, and silicon-proven solutions for various wireless standards
VeriSilicon today introduced its wireless IP platform, designed to help customers rapidly develop energy-efficient, highly integrated chips for a wide range of IoT and consumer electronics applications.
Built on the 22FDX® (22nm FD-SOI) process technology of GlobalFoundries (GF), the platform supports wireless connectivity across short, medium, and long distances, and provides a complete set of IPs with competitive power, performance, and area (PPA) features.
The platform offers complete IP solutions for standards including Bluetooth Low Energy (BLE), Bluetooth Dual Mode (BTDM), NB-IoT, and Cat.1/Cat.4, encompassing RF, baseband, and software protocol stacks. RF IPs such as GNSS, 802.11ah, and 802.15.4g have already been adopted in multiple customer chip products and achieved mass production.
By fully utilizing the high-integration and low-power advantages of FD-SOI technology, VeriSilicon’s wireless IP platform has enabled customers to successfully deploy competitive MCUs and SoCs for various markets, including low-power BLE MCUs, home security cameras based on Wi-Fi 802.11ah, and multi-channel, high-precision Global Navigation Satellite System (GNSS) SoCs. Customers have shipped over 100 million chips based on these designs, achieving strong market recognition.
“Our 22FDX® process technology delivers an ideal combination of low power, high performance, and cost efficiency for today’s connected devices,” said Ed Kaste, Senior Vice President of GF’s Ultra-Low Power CMOS Product Line. “We are excited to see VeriSilicon leverage our 22FDX® process technology to provide customers with flexible, high-performance solutions, helping accelerate innovation across diverse markets.”
Wiseway Wang, Executive Vice President and General Manager of Custom Silicon Platform Division at VeriSilicon, said:
“As demand for low-power, multi-standard connectivity continues to grow in IoT and consumer markets, our wireless IP platform provides customers with a flexible, energy-efficient foundation to rapidly develop connected devices.”
“For more than a decade, among the FD-SOI IPs we have developed on GF’s 22FDX® process, over 60 have been licensed to 45 customers, with a total of more than 300 licenses. Crucially, we were among the very first to successfully apply FD-SOI Adaptive Body Biasing (ABB) technology in mass-produced chips. So far, we have customized FD-SOI chips for 43 customers, with 33 designs already in mass production, covering fields like satellites, automotive, and smart glasses. We will continue driving the future of FD-SOI innovation for emerging applications, such as Wi-Fi 6, satellite communications, millimeter-wave radar, and hearing aids.”
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